LED display COB packaging process knowledge

LED display COB packaging process

COB (Chip on board) refers to packaging the LED light-emitting chip directly on the PCB board, realizing the conversion of the LED display unit from a "point" light source to an "area" light source, effectively improving the viewing comfort and protection of the LED display. and safety and reliability, and are mostly used in fine-pitch ultra-high-definition display solutions.

COB Advantages

·No need for brackets for direct chip welding, enabling high-density packaging.

·Use PCB board for heat dissipation to reduce chip thermal resistance and improve reliability and stability.

·Using epoxy resin to cure to improve protective performance.

·Increase the viewing angle and bring a better visual experience.

·Realizes the conversion of LED unit from "point" light source to "area" light source, making the

picture more uniform.

Significantly improves the contrast of the display screen, greatly eliminates graininess, and effectively reduces light intensity radiation.

Eliminate moiré and glare, making it less likely to cause visual fatigue.